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ROG STRIX LC RX6900XT T16G GAMING
S$2,429.00
Availability: In Stock
ROG Strix LC Radeon™ RX 6900 XT is a liquid-cooled leviathan.
- Full-coverage cold plate brings liquid cooling to GPU die and memory
- On-board cooling for power-delivery is handled by a blower-style fan and low-profile heatsink.
- 240mm radiator balances compatibility and performance.
- 600mm tubing for compatibility with EATX chassis and alternative mounts
- Super Alloy Power II includes premium alloy chokes, solid polymer capacitors, and an array of high-current power stages.
- ASUS FanConnect II equips a hybrid-controlled fan header for optimal system cooling.
- GPU Tweak II provides intuitive performance tweaking, thermal controls, and system monitoring.
ROG-STRIX-LC-RX6900XT-T16G-GAMING
Graphic Engine
AMD Radeon RX 6900 XT
Bus Standard
PCI Express 4.0
OpenGL
OpenGL®4.6
Video Memory
16GB GDDR6
Engine Clock
Gaming mode : Up to 2525 MHz (Boost Clock)/ Up to 2375 MHz (Game Clock)
Stream Processors
5120
Memory Speed
16 Gbps
Memory Interface
256-bit
Resolution
Digital Max Resolution 7680 x 4320
Interface
Yes x 1 (Native HDMI 2.1)
Yes x 2 (Native DisplayPort 1.4a)
Yes x 1 (USB Type-C)
HDCP Support Yes (2.3)
Maximum Display Support
4
NVlink/ Crossfire Support
Yes
Accessories
1 x ROG Velcro Hook & Loop 1 x ASUS ruler 1 x Collection card 1 x Speedsetup manual 1 x Cable ties pack(s)
Software
ASUS GPU Tweak II & Drivers: please download all software from the support site.
Dimensions
Card : 27.7 x 13.1 x 4.36 Centimeter Radiator 27.6 x 12 x 5.17 Centimeter (including fan)
Recommended PSU
850W
Power Connectors
3 x 8-pin
Slot
2.2 Slot
AURA SYNC
ARGB
Note
* Crossfire Support for DirecX® 12 and Vulkan® * ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary. * ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
